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  Datasheet File OCR Text:
 SE MICO NDU C TOR
DO-35 Hermetically
Sealed Glass BI-directional Trigger Diode
AXIAL LEAD DO35
Absolute Maximum Ratings
Symbol PD ITRM Tstg Tj
TA = 25C unless otherwise noted Value 150 2 -40 ~ 125 Units mW A C
DEVICE MARKING DIAGRAM
Parameter Power Dissipation @ Ta = 50 Repetitive peak on-state current tp = 20us, F = 120Hz Storage temperature range Operating junction temperature
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
VBO = 32V DO-35 Package (JEDEC) Through-Hole Device Type Mounting Hermetically Sealed Glass Compression Bonded Construction All External Surfaces Are Corrosion Resistant And Leads Are Readily Solderable RoHS Compliant Solder Hot Dip Tin (Sn) Terminal Finish
Electrical Characteristics
Symbol VBO [VBO' ]- [VBO] [V] Breakover Voltage
TA = 25C unless otherwise noted Parameter Test Condition C = 22nF (note 2) C = 22nF (note 2) VBO and VF at 10mA See diagram 2 5 28 Limits Min Max 36 3 Volts Volts Volts Unit
Breakover Voltage Symmetry Dynamic Breakover Voltage
Vo
Output Voltage (R = 20)
5
Volts
IBO TR IB IP
Breakover Current Rise Time Leakage Current Peak Current
C = 22nF (note 2) See diagram 3 VR = 0.5VBO max See diagram 2
50 2 10 0.3
uA uS uA A
Notes: 1. All parameters applicable to both forward and reverse directions. 2. Connected in parallel in the device
Number: DB-131 November 2008 / A Page 1
KELDB3
SE MICO NDU C TOR
DIAGRAM 1: VOLTAGE - CURRENT CHARACTERISTIC CURVE DIAGRAM 2: TEST CIRCUIT
DIAGRAM 3: RISE TIME MEASUREMENT
Package Outline
Package Case Outline
DO-35 DO-35 DIM
Min
Millimeters
Max Min
Inches
Max
A B C D
0.46 3.05 25.40 1.53
0.55 5.08 38.10 2.28
0.018 0.120 1.000 0.060
0.022 0.200 1.500 0.090
Notes: 1. All dimensions are within JEDEC standard.
Number: DB-131 November 2008 / A Page 2
DISC LA IMER NOTIC E
NOTICE
The information presented in this document is for reference only. Tak Cheong reserves the right to make changes without notice for the specification of the products displayed herein. The product listed herein is designed to be used with ordinary electronic equipment or devices, and not designed to be used with equipment or devices which require high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such improper use of sale. This publication supersedes & replaces all information previously supplied. For additional information, please visit our website http://www.takcheong.com, or consult your nearest Tak Cheong's sales office for further assistance.
Number: DB-111 April 29, 2008 / A


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